Tech Synaptics’ Triple Combo™ Heterogeneous Wireless Solution Globe News Wire Feb 1, 2023 <!-- Name:DistributionId Value:8741035 --> <!-- Name:EnableQuoteCarouselOnPnr Value:False --> <!-- Name:IcbCode Value:9500 -->…
BusinessWire Chiplet Summit Helps Chip Designers with Heterogeneous Integration Business Wire News Jan 19, 2023 SAN DIEGO--(BUSINESS WIRE)--Chiplet Summit Covers the Latest Approaches. The new Chiplet Summit will help designers develop new chips faster and cheaper. The idea of dividing large chips into small units is a powerful approach that allows…