Deepening collaboration with NVIDIA to bring NVIDIA Vera Rubin NVL144 and NVIDIA Vera Rubin CPX platforms to market in 2026…
New contributions to OCP include Foundation Chiplet System Architecture (FCSA) and BoW 2.0 for memory-intensive AI and HPC workloads SAN…
New DLC-2 4U Front I/O liquid-cooled system provides up to 40% data center power savings8U front I/O air-cooled system delivers…
Recognized for technology leadership in unified interconnect architecture, customer success, and its ability to meet emerging needs across AI and…
Event will showcase AI-powered engineering, smart manufacturing, and scaling intelligence with HPC and AI TROY, Mich., June 10, 2025 /PRNewswire/…
TEL AVIV, Israel, June 10, 2025 (GLOBE NEWSWIRE) -- LightSolver, inventors of a new laser-based computing paradigm, and HLRS (High-Performance…