New contributions to OCP include Foundation Chiplet System Architecture (FCSA) and BoW 2.0 for memory-intensive AI and HPC workloads SAN…
New DLC-2 4U Front I/O liquid-cooled system provides up to 40% data center power savings8U front I/O air-cooled system delivers…
Recognized for technology leadership in unified interconnect architecture, customer success, and its ability to meet emerging needs across AI and…
Event will showcase AI-powered engineering, smart manufacturing, and scaling intelligence with HPC and AI TROY, Mich., June 10, 2025 /PRNewswire/…
TEL AVIV, Israel, June 10, 2025 (GLOBE NEWSWIRE) -- LightSolver, inventors of a new laser-based computing paradigm, and HLRS (High-Performance…